Investigations on the Interface Microstructure of Stainless Steel/Aluminum Joints Created by the Surface Activated Bonding Method

Interface Science

Volumn 5, Issue 4, 1997, Pages 279-286

  Yang, Liu ^a   Hosoda, Naoe ^a   Suga, Tadatomo ^a  

^a UNIVERSITY OF TOKYO   (Japan)

Author keywords

Aluminum; Interface microstructure; Stainless steel; Surface activated bonding; TEM

Indexed keywords

ALUMINUM; BONDING; INTERFACES (MATERIALS); JOINTS (STRUCTURAL COMPONENTS); MICROCRACKS; MICROSCOPIC EXAMINATION; POROSITY;

STEEL ALUMINUM JOINTS; SURFACE ACTIVATED BONDING;

STAINLESS STEEL;

EID: 0031271757     PISSN: 09277056     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1008667905403     Document Type: Article

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