Mechanism studies of Cu RIE for VLSI interconnections

Microelectronic Engineering

Volumn 37-38, Issue , 1997, Pages 127-133

  Markert, M ^a   Bertz, A ^a   Gessner, T ^a  

^a CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Copper; Dry etching; Interconnects; Metallization; RIE

Indexed keywords

CHLORINE; COMPOSITION EFFECTS; COPPER; DRY ETCHING; MASS SPECTROMETRY; METALLIC FILMS; METALLIZING; REACTIVE ION ETCHING; VLSI CIRCUITS;

VOLATILIZATION;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0031270153     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(97)00103-2     Document Type: Article

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