Adhesion mechanisms of copper films deposited onto laser-irradiated alumina

Journal of Materials Research

Volumn 12, Issue 11, 1997, Pages 3174-3181

  Park, Jae Won ^a   Pedraza, Anthony J ^a   Lowndes, Douglas H ^b   Allen, William R ^c  

^a University of Tennessee Knoxville   (United States)

^b OAK RIDGE NATIONAL LABORATORY   (United States)

^c Information Management Services   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ALUMINA; AUGER ELECTRON SPECTROSCOPY; BOND STRENGTH (MATERIALS); COPPER; INTERFACES (MATERIALS); LASER BEAM EFFECTS; OXIDATION; OXYGEN; REACTION KINETICS; SUBSTRATES; SURFACE STRUCTURE;

TRANSITIONAL REGION;

METALLIC FILMS;

EID: 0031270022     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.1997.0414     Document Type: Article

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