An other way to assess electronics part reliability

Microelectronics Reliability

Volumn 37, Issue 10-11, 1997, Pages 1449-1452

  Charpenel, P ^a   Cavernes, P ^b   Borowski, J ^b   Chopin, Jm ^a  

^a Aerospatiale Aeronautique Toulouse   (France)

^b Nexter Munitions   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONIC EQUIPMENT TESTING; FAILURE ANALYSIS; PERFORMANCE; PRODUCT DESIGN; QUALITY ASSURANCE;

ELECTRONICS DEVICE RELIABILITY; ELECTRONICS SYSTEM RELIABILITY;

RELIABILITY;

EID: 0031249817     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(97)00084-X     Document Type: Article

References (5)

1. M.J. CUSHING et al., "Comparison of electronics-reliability assessment approaches", IEEE Trans. Reliability, Vol.42, no4, 1993.
2. MIL-HDBK-217 F
3. CNET RDF 1993
4. L.W. CONDRA et al., "Using Plastic-Encapsulated Microcircuits in high reliability environment", Proc. Reliability and Maintenability Symp., 1994.
5. M. ZAHID et al., "Evaluation of reliability prediction methodologies", Proc. ESREF 1993.