Fatigue crack growth behavior in a TiAl based aluminide with lamellar microstructure

Zairyo/Journal of the Society of Materials Science, Japan

Volumn 46, Issue 10, 1997, Pages 1167-1172

  Mine, Yoji ^a   Morofuji, Yusuke ^a   Ando, Shinji ^a   Takashima, Kazuki ^a   Tonda, Hideki ^a  

^a KUMAMOTO UNIVERSITY   (Japan)

Author keywords

Crack tip shielding; Fatigue crack growth; Intermetallics; Lamellar microstructure; Titanium aluminide

Indexed keywords

CRACK PROPAGATION; FATIGUE OF MATERIALS; HEAT TREATMENT; INTERMETALLICS; METALLOGRAPHIC MICROSTRUCTURE;

CRACK TIP SHIELDING; FATIGUE CRACK GROWTH RESISTANCE; LAMELLAR COLONY SIZE; LAMELLAR MICROSTRUCTURES; SINGLE EDGE NOTCHED (SEN) TESTS; TITANIUM ALUMINIDES;

TITANIUM ALLOYS;

EID: 0031249570     PISSN: 05145163     EISSN: None     Source Type: Journal    
DOI: 10.2472/jsms.46.1167     Document Type: Article

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