Three-dimensional interconnect technology for ultra-compact MMICs

Solid-State Electronics

Volumn 41, Issue 10, 1997, Pages 1451-1455

  Hirano, Makoto ^a   Nishikawa, Kenjiro ^a   Toyoda, Ichihiko ^a   Aoyama, Shinji ^a   Sugitani, Suehiro ^a   Yamasaki, Kimiyoshi ^a  

^a NTT CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROPLATING; INTEGRATED CIRCUIT MANUFACTURE; POLYIMIDES; REACTIVE ION ETCHING; TUNGSTEN COMPOUNDS;

FOLDED METAL INTERCONNECTION TECHNOLOGY (FMIT); METAL STOPPERS; MICROWIRES;

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 0031248564     PISSN: 00381101     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0038-1101(97)00088-9     Document Type: Article

References (8)

1. Toyoda, I., Hirano, M. and Tokumitsu, T., An Ultra-Wide band Miniature Balun for 3-Dimensional MMICs, IEICE Trans. On Electronics, 1995, E78-C, 919-924.
2. Hirano, M., Nishikawa, K., Toyoda, I., Aoyama, S., Sugitani, S. and Yamasaki, K., Three-Dimensional Passive Circuit Technology For Ultra-Compact MMICs, IEEE Trans. on MTT, 1995 43(12), 2845-2850.
3. Onodera, K., Hirano, M., Tokumitsu, M., Toyoda, I., Nishikawa, K. and Tokumistu, T., Folded U-Shaped Microwire Technology for Ultra-Compact 3-D MMICs, IEEE MTT-S Digest, 1996, 2, 1153-1156.
4. Green, M. W., Green, G. J., Arnold, R. G., Jenkins, J. A. and Jansen, R. H., Miniature Multilayer Spiral Inductors For GaAs MMICs, IEEE GaAs IC Symp., 1989, 303-306.
5. Tokumitsu, T., Hiraoka, T., Nakamoto, H. and Takenaka, T., Multilayer MMIC Using a 3 mm x 3-layer Dielectric Film Structure, 1990 IEEE MTT-S Digest, 1990, S-5, 831-834.
6. Toyoda, I., Hirota, T., Hiraoka, T. and Tokumitsu, T., Multilayer MMIC Branch-Line Coupler and Broad-Side Coupler, IEEE 1992, MMWMC Digest, 1992, 79-82.
7. Hirano, M., Toyoda, I., Tokumitsu, M. and Asai, K., Folded U-Shaped Microwire Technology For GaAs IC Interconnections, IEEE GaAs IC Symp., 1992, 177-180.
8. Toyoda, I., Tokumitsu, T. and Aikawa, M., Highly Integrated Three-Dimensional MMIC Single-Chip Receiver and Transmitter, 1996 IEEE MTT-S Digest, 1996, 3, 1209-1212.