SCOPUS 정보 검색 플랫폼

Thin Solid Films

Volumn 308-309, Issue 1-4, 1997, Pages 490-494

Application of SiO2 aerogel film with low dielectric constant to intermetal dielectrics

(6) Jo, Moon Ho a Hong, Jung Kyun a Park, Hyung Ho a Kim, Joong Jung a Hyun, Sang Hoon a Choi, Se Young a

a Yonsei University (South Korea)

Author keywords

Intermetal dielectrics; Low dielectric constant; SiO2 aerogel

Indexed keywords

CRYSTAL MICROSTRUCTURE; FOURIER TRANSFORM INFRARED SPECTROSCOPY; PERMITTIVITY; PLASMA ETCHING; POROSITY; POROUS MATERIALS; RUTHERFORD BACKSCATTERING SPECTROSCOPY; SILICA GEL; THIN FILMS; X RAY PHOTOELECTRON SPECTROSCOPY;

INTERMETAL DIELECTRICS; SILICA AEROGEL FILMS;

DIELECTRIC FILMS;

EID: 0031247647 PISSN: 00406090 EISSN: None Source Type: Journal
DOI: 10.1016/S0040-6090(97)00437-9 Document Type: Article

Times cited : (42)

References (14)

1
- 0003552056
- Semiconductor Industry Association
- The National Technology Roadmap for Semiconductor, Semiconductor Industry Association, (1994) 94.
- (1994) The National Technology Roadmap for Semiconductor , pp. 94

2
- 0346786847
- R. Blumenthal, G. Jassen (Eds.)
- M. Kawano, T. Tangiguchi, in: R. Blumenthal, G. Jassen (Eds.), Advanced Metallization for ULSI Applications in 1994, (1995) 525.
- (1995) Advanced Metallization for ULSI Applications in 1994 , pp. 525
- Kawano, M.¹ Tangiguchi, T.²

3
- 0030397371
- K.N. Tu, J.W. Mayer, J.M. Poate, L.J. Chen (Eds.), Advanced Metallization for future VLSI
- B. Zhao, S.-Q. Wang, S. Anderson, R. Lam, M. Fiehig, P.K. Vasudev, T.E. Seidel, in: K.N. Tu, J.W. Mayer, J.M. Poate, L.J. Chen (Eds.), Advanced Metallization for future VLSI, Proc. Mat. Res. Soc Symp., 427 (1996) 415.
- (1996) Proc. Mat. Res. Soc Symp. , vol.427 , pp. 415
- Zhao, B.¹ Wang, S.-Q.² Anderson, S.³ Lam, R.⁴ Fiehig, M.⁵ Vasudev, P.K.⁶ Seidel, T.E.⁷

4
- 0012012582
- C.B. Case, A. Kornblit, K.S.Y. Lau, N.H. Hendricks, Proc. International IEEE VLSI Multilevel Interconnection Conference, 104 (1995) 116.
- (1995) Proc. International IEEE VLSI Multilevel Interconnection Conference , vol.104 , pp. 116
- Case, C.B.¹ Kornblit, A.² Lau, K.S.Y.³ Hendricks, N.H.⁴

5
- 19444365479
- S.P. Murarka, Sol. State. Tech. Mar., (1996) 83.
- (1996) Sol. State. Tech. Mar. , pp. 83
- Murarka, S.P.¹

6
- 0001151845
- M.H. Jo, J.K. Hong, H.H. Park, J.J. Kim, S.H. Hyun, Microelctronic Eng., 33 (1997) 343.
- (1997) Microelctronic Eng. , vol.33 , pp. 343
- Jo, M.H.¹ Hong, J.K.² Park, H.H.³ Kim, J.J.⁴ Hyun, S.H.⁵

7
- 0343494496
- M.H. Jo, H.H. Park, D.J. Kim, S.H. Hyun, S.Y. Choi, J.T. Paik, J. App. Phys., 82 (1997) 1299.
- (1997) J. App. Phys. , vol.82 , pp. 1299
- Jo, M.H.¹ Park, H.H.² Kim, D.J.³ Hyun, S.H.⁴ Choi, S.Y.⁵ Paik, J.T.⁶

8
- 0001169181
- D.J. Kim, S.H. Hyun, J. Korean Ceram. Soc., 33 (1996) 485.
- (1996) J. Korean Ceram. Soc. , vol.33 , pp. 485
- Kim, D.J.¹ Hyun, S.H.²

9
- 0004198677
- Academic Press, Orlando
- W.K. Chu, J.W. Mayer, M.A. Nicolet, Backscattering Spectrometry, (Academic Press, Orlando, 1978), p. 86.
- (1978) Backscattering Spectrometry , pp. 86
- Chu, W.K.¹ Mayer, J.W.² Nicolet, M.A.³

10
- 34247505686
- L.W. Hrubesh, J.F. Poco, J. Non-Cryst. Solids, 188 (1995) 46.
- (1995) J. Non-Cryst. Solids , vol.188 , pp. 46
- Hrubesh, L.W.¹ Poco, J.F.²

11
- 0027623448
- L.W. Hrubesh, L.E. Keene, V.R. Latorre, J. Mater. Res., 8 (1993) 1736.
- (1993) J. Mater. Res. , vol.8 , pp. 1736
- Hrubesh, L.W.¹ Keene, L.E.² Latorre, V.R.³

12
- 24844480517
- R. Vacher, T. Woigner, J. Pelous, Phys. Rev., B 6500 (1988) 37.
- (1988) Phys. Rev., B , vol.6500 , pp. 37
- Vacher, R.¹ Woigner, T.² Pelous, J.³

13
- 0039677979
- B.K. Hwang, J.H. Choi, H.J. Shin, U.I. Chung, S.I. Lee, M.Y. LEE, Proc. International IEEE VLSI Multilevel Interconnection Conference, 104 (1995) 113.
- (1995) Proc. International IEEE VLSI Multilevel Interconnection Conference , vol.104 , pp. 113
- Hwang, B.K.¹ Choi, J.H.² Shin, H.J.³ Chung, U.I.⁴ Lee, S.I.⁵ Lee, M.Y.⁶

14
- 0348047847
- T. Homma, Y. Murao, Proc. International IEEE VLSI Multilevel Interconnection Conference, 101 (1992) 65.
- (1992) Proc. International IEEE VLSI Multilevel Interconnection Conference , vol.101 , pp. 65
- Homma, T.¹ Murao, Y.²

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.