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IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing
Volumn 20, Issue 4, 1997, Pages 243-255
Integrated circuit packaging industry in Taiwan
Author keywords

[No Author keywords available]
Indexed keywords

ELECTRIC INDUSTRY; MANUFACTURE; PACKAGING; PACKAGING MACHINES; PRINTED CIRCUIT BOARDS;
EID: 0031246644     PISSN: 10834400     EISSN: None     Source Type: Journal    
DOI: 10.1109/3476.650952     Document Type: Article
Times cited : (4)
References (24)
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.