Dielectric testing for integrated power devices

Microelectronics Reliability

Volumn 37, Issue 10-11, 1997, Pages 1763-1766

  Oussalah, S ^a   Jerisian, R ^a  

^a UNIVERSITÉ DE TOURS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT DENSITY; DIELECTRIC FILMS; POWER ELECTRONICS; RELIABILITY; SILICON WAFERS;

CHARGE INJECTION; EXPONENTIAL RAMP CURRENT STRESS; INTEGRATED POWER DEVICES;

INTEGRATED CIRCUIT TESTING;

EID: 0031246425     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(97)00156-X     Document Type: Article

References (6)

1. C. MARCHAND, internal communication SGS-Thomson Tours (1996)
2. E. CIANTAR, thesis, University of Montpellier (1995)
3. S. WOLF, Silicon Processing, (Lattice Press), vol. 3, pp. 458-494, California (1995)
4. C. MONSERIE, thesis, University of Grenoble (1994)
5. D.J. DIMARIA, E. CARTIER and D. ARNOLD, J. Appl. Phys., 73, 7, 3367-3384 (1993)
6. A. AASSIME, thesis, University of Reims (1996).