Automated placement of testing pads for electron-beam observation

Microelectronics Reliability

Volumn 37, Issue 10-11, 1997, Pages 1565-1568

  Kuji, Norio ^a   Takeda, Tadao ^a  

^a NTT CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; ELECTRON BEAMS; INTEGRATED CIRCUIT LAYOUT; REACTIVE ION ETCHING;

ELECTRON BEAM TESTING; FOCUSED ION BEAM;

LSI CIRCUITS;

EID: 0031245877     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(97)00111-X     Document Type: Article

References (4)

1. Y. Mashiko, H. Morimoto, H. Koyama, S. Kawazu, T. Kaito, and A. Adachi, "Anew VLSI Diagnosis Technique: Focused Ion Beam Assisted Multi-Level Circuit Probing," Reliability Physics 25th Annual Proceedings, 1987, pp. 111-117.
2. G. Matusiewicz, "RIE for Failure Analysis," Proceedings of the International Symposium for Testing and Failure Analysis, Los Angeles, California, November 6-10, 1989.
3. Masamichi Ino, Toshiaki Tsuchiya, Ken Takeya, and Testsuhshi Sakai, "LSI Applications of 0.25-um CMOS/SIMOX Technology", Proceedings of ISDM'96 , pp. 482-484, April 1996.
4. Hiromu Fujioka, Kouji Nakamae and Katsumi Ura, "Local Field Effects on Voltage Measurements in the SEM," SEM/I, pp. 323-332, 1981.