Factors affecting adhesion at copper-polyamide 11 and aluminum-polyamide 11 interfaces

Journal of Thermoplastic Composite Materials

Volumn 10, Issue 5, 1997, Pages 416-434

  Gundjian, M ^a   Fisa, B ^a  

^a ÉCOLE POLYTECHNIQUE DE MONTRÉAL   (Canada)

Author keywords

Adhesion; Aluminum; Copper; Crystallization; Polyamide 11

Indexed keywords

ADHESION; ALUMINUM; COMPRESSION MOLDING; COPPER; CRYSTAL STRUCTURE; CRYSTALLIZATION; INTERFACES (MATERIALS); LAMINATES; OXIDATION; POLYAMIDES;

ALUMINUM POLYAMIDE; COPPER POLYAMIDE;

METALLORGANIC POLYMERS;

EID: 0031238106     PISSN: 08927057     EISSN: None     Source Type: Journal    
DOI: 10.1177/089270579701000501     Document Type: Article

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