Transient Liquid Phase (TLP) diffusion bonding of a copper based shape memory alloy using silver as interlayer

Scripta Materialia

Volumn 37, Issue 6, 1997, Pages 861-867

  Gomez de Salazar J M ^a   Mendez F J ^a   Urena A ^a   Guilemany, J M ^a   Mellor, B G ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; DIFFERENTIAL SCANNING CALORIMETRY; DIFFUSION; ELECTRON BEAM WELDING; ENTHALPY; HEAT AFFECTED ZONE; MARTENSITIC TRANSFORMATIONS; SHAPE MEMORY EFFECT; SILVER;

SHAPE MEMORY ALLOY; TRANSIENT LIQUID PHASE;

COPPER ALLOYS;

EID: 0031235111     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/s1359-6462(97)00182-6     Document Type: Article

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