Elevated temperature fracture toughness of AI-Cu-Mg-Ag sheet: Characterization and modeling

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 28, Issue 9, 1997, Pages 1815-1829

  Haynes, Michael J ^a,b   Gangloff, Richard P ^c  

^a UNIVERSITY OF VIRGINIA   (United States)

^b TEXAS INSTRUMENTS   (United States)

^c University of Virginia   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM ALLOYS; COALESCENCE; CRACK PROPAGATION; ELASTIC MODULI; FRACTOGRAPHY; FRACTURE TOUGHNESS; HIGH TEMPERATURE PROPERTIES; MATHEMATICAL MODELS; STRAIN; STRAIN HARDENING; STRESS ANALYSIS; THERMAL EFFECTS;

J INTEGRAL METHOD; MICROMECHANICAL MODEL; VOID SHEETING;

ALUMINUM SHEET;

EID: 0031234958     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-997-0112-8     Document Type: Article

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