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Volumn 37, Issue 2, 1997, Pages 287-298

Aluminum-assisted joining of beryllium to copper for fusion applications

Author keywords

Aluminium coatings; Beryllium; Bonding techniques; Copper

Indexed keywords

ALUMINUM; APPLICATIONS; BONDING; COPPER; FUSION REACTORS; JOINING; PLASMA SPRAYING; PROTECTIVE COATINGS;

EID: 0031224548     PISSN: 09203796     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0920-3796(97)00053-7     Document Type: Article
Times cited : (8)

References (9)
  • 1
    • 0345918206 scopus 로고
    • Bonding Beryllium to CuCrZr using Hot Isostatic Pressing, TR-1011
    • JDO/14691
    • D.E. Dombrowski, D. Hashiguchi, Bonding Beryllium to CuCrZr using Hot Isostatic Pressing, TR-1011, JET Final Report, JDO/14691, 1990.
    • (1990) JET Final Report
    • Dombrowski, D.E.1    Hashiguchi, D.2
  • 2
    • 85033109258 scopus 로고
    • Bonding Beryllium Layer to Copper Substrate, TR-1000
    • JD9/13197
    • D. Hashiguchi, Bonding Beryllium Layer to Copper Substrate, TR-1000, JET Final Report, JD9/13197, 1990.
    • (1990) JET Final Report
    • Hashiguchi, D.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.