Study of CF4, C2F6, SF6 and NF3 decomposition characteristics and etching performance in plasma state

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 36, Issue 9 A, 1997, Pages 5724-5728

  Koike, Kunihiko ^a   Fukuda, Tatsuo ^a   Fujikawa, Shizuichi ^b   Saeda, Manabu ^b  

^a Iwatani International Corp   (Japan)

^b Iwatani Gas Res Lab Co   (Japan)

Author keywords

Etching; PE CVD; Perfluorinated compounds (PFCs); Plasma decomposition; Self cleaning

Indexed keywords

DECOMPOSITION; ETCHING; FLUOROCARBONS; NITROGEN COMPOUNDS; PLASMA APPLICATIONS; PLASMA DENSITY; SULFUR COMPOUNDS;

PERFLUORINATED COMPOUNDS; PLASMA DECOMPOSITION; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SELF CLEANING GASES;

CHEMICAL VAPOR DEPOSITION;

EID: 0031224075     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.36.5724     Document Type: Article

References (5)

1. M. T. McClear and P. A. Taylor: Eur. Semicond. 41 (1996) July/August.
2. K. Koike and T. Manabe: Proc. SEMI Technol. Symp., Chiba, 1996, p. 4-23.
3. H. Naruse and K. Kumamaru: Ext. Abstr. (37th Spring Meet. 1990); Japan Society of Applied Physics and Related Societies, 28a-ZF-5 [in Japanese].
4. Handotai Kogyo-yo Gasu Anzen Handobukku (Handbook for Safe Gas Handling in Semicondudtor Industry) (Safety Industry Association, 1996) revised, p. 180 [in Japanese].
5. M. Nakamura, T. Ohmi, A. Ohki, K. Kawada, K. Hirao and T. Watanabe: Proc. 15th Workshop on Ultra Clean Technol., Tokyo, 1991, p. 159 [in Japanese].