Adhesion strength of silver thick-film conductors by solder-free test

Journal of Materials Science

Volumn 32, Issue 18, 1997, Pages 4967-4971

  Enokido, Y ^a   Yamaguchi, T ^a  

^a KEIO UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ADHESIVE JOINTS; ALUMINA; CRACK PROPAGATION; FRACTURE TESTING; MICROSTRUCTURE;

ADHESION STRENGTH; SOLDER-FREE TEST;

SILVER;

EID: 0031221659     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1018632425726     Document Type: Article

References (16)

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