Thermally Stable, Low Saturation Field, Low Hysteresis, High GMR CoFe/Cu Multilayers

IEEE Transactions on Magnetics

Volumn 33, Issue 5 PART 2, 1997, Pages 3520-3522

  Wang, D ^a  

^a NVE CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; COBALT ALLOYS; COPPER; IRON; MAGNETIC HYSTERESIS; MAGNETORESISTANCE; METALLIC SUPERLATTICES; SILICON NITRIDE; SILICON WAFERS; SPUTTER DEPOSITION; THERMAL EFFECTS; THERMODYNAMIC STABILITY;

SATURATION FIELD;

MAGNETIC FILMS;

EID: 0031220166     PISSN: 00189464     EISSN: None     Source Type: Journal    
DOI: 10.1109/20.619484     Document Type: Article

References (5)

1. T.R. McGuire, J.M. Harper, C. Cabrai Jr., and T.S. Plaskett, Giant magnetoresistance in Co/Cu multilayers after annealing, J. Appl Phys., vol. 76, pp. 6601-6603, November 1994.
2. S.A. Hossain, B.H. Pirkle, J. Yang, and M.R. Parker, Giant magnetoresistance multilayers of high thermal stability with thicker magnetic layers, J. Appl Phys., vol. 79, pp. 5817-5819, April 1996.
3. S.S.P. Parkin, R. Bhadra, and K.P. Roche, Oscillatory magnetic exchange coupling through thin copper layers, Phyi. Rev. Lett. vol. 66, pp. 21522155, April 1991.
4. M. Jimbo, S. Hirano, K. Meguro, S. Tsunashima, and S. Uchiyama, Giant magnetoresistance with low saturation field in NiwFeisCoWCu multilayers, Jpn. J. Appl. Phys., vol. 33, pp. 850-853, June 1994.
5. D. Wang et al, Thermal stability of NiFeCo/Cu multilayers and hs compatibility with GMR/IC integration, unpublished.