Effect of substrate surfaces and heat treatments on adhesion of Cu films

Materials Letters

Volumn 32, Issue 2-3, 1997, Pages 185-189

  Choi, Guang J ^a   Cho, Young S ^a  

^a Korea Institute of Science and Technology   (South Korea)

Author keywords

Adhesion; Cu films; Heat treatments; Substrate surfaces

Indexed keywords

ADHESION; COPPER; HEAT TREATMENT; METALLORGANIC CHEMICAL VAPOR DEPOSITION; OXIDATION; RESIDUAL STRESSES; SILICON; TITANIUM NITRIDE;

COPPER FILM; TENSILE STRESS;

METALLIC FILMS;

EID: 0031212669     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-577X(97)00024-4     Document Type: Article

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