Advanced flip-chip solder bonding

Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Volumn 395, Issue 3, 1997, Pages 375-378

  Humpston, G ^a   Needham, A P ^a  

^a GEC Marconi Materials Technology Ltd   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP DEVICES; MICROELECTRONIC PROCESSING; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; MULTICHIP MODULES; RADIATION DETECTORS;

FLIP CHIP SOLDER BONDING; PIXELATED DETECTORS;

SOLDERING;

EID: 0031211730     PISSN: 01689002     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0168-9002(96)01239-9     Document Type: Article

References (0)