The determination of the grain boundary width of ultrafine grained copper and nickel from electrical resistivity measurements

Physica Status Solidi (A) Applied Research

Volumn 162, Issue 2, 1997, Pages 559-566

  Islamgaliev, R K ^a   Pekala, K ^b   Pekala, M ^c   Valiev, R Z ^a  

^a Birsk Branch of Federal State Budgetary Educational Establishment of Higher Education Bashkir State University   (Russian Federation)

^b WARSAW UNIVERSITY OF TECHNOLOGY   (Poland)

^c UNIVERSITY OF WARSAW   (Poland)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CRYSTALLOGRAPHY; ELECTRIC CONDUCTIVITY MEASUREMENT; GRAIN SIZE AND SHAPE; NICKEL; PLASTIC DEFORMATION; THERMAL EFFECTS; TRANSMISSION ELECTRON MICROSCOPY;

POTENTIAL BARRIERS;

GRAIN BOUNDARIES;

EID: 0031210705     PISSN: 00318965     EISSN: None     Source Type: Journal    
DOI: 10.1002/1521-396X(199708)162:2<559::AID-PSSA559>3.0.CO;2-Z     Document Type: Article

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