AES investigation of electrochemically deposited Co-W layers on copper

Journal of Materials Science Letters

Volumn 16, Issue 15, 1997, Pages 1305-1306

  Mayanna, S M ^a   Ramesh, L ^a   Maruthi, B N ^a   Landolt, D ^b  

^a BANGALORE UNIVERSITY   (India)

^b Laboratory of Mechanical Metallurgy Ecole Polytechnique Federale de Lausanne   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITION REACTIONS; AGENTS; ATOMS; AUGER ELECTRON SPECTROSCOPY; COBALT ALLOYS; COMPOSITION; COPPER; ELECTRODEPOSITION; INCLUSIONS; SURFACES; TUNGSTEN; X RAY PHOTOELECTRON SPECTROSCOPY;

DIAMMONIUM CITRATE; DIMETHYL SULFOXIDE; THIETHANOLAMINE;

METALLIC FILMS;

EID: 0031207983     PISSN: 02618028     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1018543428838     Document Type: Article

References (6)

1. W. H. SAFRANEK and L. E. VAALER, Plating 46 (1959) 133.
2. F. A. STILL and J. K. DENNIS, Electroplat. Met. Finish. 26 (1974) 9.
3. TAMURA et. al., Kyushu Kogyo Daigaku Kentiya Hokoku Kogaku 32 (1976) 61.
4. T. MIMANI and S. M. MAYANNA, J. Electrochem. Soc. 140 (1993) 984.
5. A. BRENNER, Electrodeposition of Alloys (Academic Press, New York, 1963) pp. 347-412.
6. A. VOGEL, Secondary Ion Mass Spectrometry 14 (1989).