Stress intensity measurement via infrared focal plane array

ASTM Special Technical Publication

Volumn 1318, Issue , 1997, Pages 208-220

  Lesniak, Jon R ^a   Bazile, Daniel J ^a   Boyce, Bradley R ^a   Zickel, Michael J ^a   Elliott Cramer, K ^b   Welch, Christopher S ^c  

^a Stress Photonics Inc   (United States)

^b NASA LANGLEY RESEARCH CENTER   (United States)

^c Dept of Economics and Thomas Jefferson Program in Public Policy at the College of William and Mary   (United States)

Author keywords

Crack; Fracture; Infrared; Stress; Stress Intensity Factor; Thermal; Thermoelastic

Indexed keywords

ALGORITHMS; CRACK PROPAGATION; DYNAMIC LOADS; FATIGUE TESTING; FRACTURE TESTING; INFRARED DETECTORS; STRESS ANALYSIS; THERMOELASTICITY;

INFRARED FOCAL PLANE ARRAY; THERMOELASTIC STRESS ANALYSIS (TSA);

STRESS INTENSITY FACTORS;

EID: 0031207057     PISSN: 00660558     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (9)

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