Agglomeration phenomena of high temperature coefficient of resistance platinum films deposited by electron beam evaporation

Journal of Materials Science Letters

Volumn 16, Issue 15, 1997, Pages 1257-1259

  Lee, Jae Suk ^a   Park, Hyo Derk ^b   Shin, Sang Mo ^b   Park, Jong Wan ^a  

^a Hanyang University   (South Korea)

^b Korea Electronic Technology Institute (KETI)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AGGLOMERATION; ELECTRON BEAMS; EVAPORATION; HEAT RESISTANCE; HIGH TEMPERATURE REACTORS; MORPHOLOGY; OXIDATION; PLATINUM; SCANNING ELECTRON MICROSCOPY; SURFACE ROUGHNESS; SURFACE TREATMENT;

ELECTRON BEAM EVAPORATION; HIGH TEMPERATURE COEFFICIENT OF RESISTANCE; PROFILOMETER;

METALLIC FILMS;

EID: 0031206823     PISSN: 02618028     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1018562505640     Document Type: Article

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