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Thin Solid Films

Volumn 306, Issue 1, 1997, Pages 171-173

Non-destructive, interferometric method for measuring the thickness of a silicon membrane

(2) Adee, J M a Steinbruchel Ch a

a RENSSELAER POLYTECHNIC INSTITUTE (United States)

Author keywords

Coatings; Etching; Infrared spectroscopy; Silicon

Indexed keywords

COATINGS; ETCHING; INFRARED SPECTROSCOPY; INTERFEROMETRY; NONDESTRUCTIVE EXAMINATION; THICKNESS MEASUREMENT;

SILICON MEMBRANES;

SILICON SENSORS;

EID: 0031200687 PISSN: 00406090 EISSN: None Source Type: Journal
DOI: 10.1016/S0040-6090(97)00258-7 Document Type: Article

Times cited : (3)

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