Microelectronic test structures for rapid automated contactless inline defect inspection

IEEE Transactions on Semiconductor Manufacturing

Volumn 10, Issue 3, 1997, Pages 384-389

  Satya, Aakella V S ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFECTS; ELECTRON EMISSION; INSPECTION; MICROELECTRONIC PROCESSING; OPTICAL RESOLVING POWER; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR DEVICE TESTING;

AUTOMATED CONTACTLESS INLINE DEFECT INSPECTION; MICROELECTRONIC TEST STRUCTURES; VOLTAGE CONTRAST (VC) MODE;

SEMICONDUCTOR DEVICE STRUCTURES;

EID: 0031199689     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/66.618211     Document Type: Article

References (7)

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3. P. J. Bonk, M. R. Gupta, R. Hamilton, and A. V. S. Satya, "Manufacturing yield," Hand Book of IC Manufacturing Diagnostics, A. Landzberg, Ed. New York: Van Nostrand, 1993, ch. II, pp. 9-35.
4. A. V. S. Satya, "Understanding the clustering of defects in a sub-0.5μm CMOS fabricator," in Proc. IEEE Int. Conf. on Microelectronic Test Structures, Nara, Japan, 1995, pp. 295-297.
5. J. A. Cunningham, Clustering Algorithms. New York: Wiley, 1975.
6. L. R. Bentson, "Monitoring defects by SEM beam charging," IBM Tech. Discl. Bull. (IBM TDB), BU8-84-0024, 1984.
7. A. K. B. Yahya, "Voltage contrast application for hybrid circuit analysis," in Proc. 4th Int. Symp. Physical and Failure Analysis, Singapore, 1993.