Triple junction and grain boundary character distributions in metallic materials

Acta Materialia

Volumn 45, Issue 8, 1997, Pages 3459-3467

  Fortier, P ^a   Miller, W A ^a   Aust, K T ^a  

^a UNIVERSITY OF TORONTO   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; COMPUTER SIMULATION; COPPER; COPPER ALLOYS; ELECTRON DIFFRACTION; MATHEMATICAL MODELS;

COINCIDENCE SITE LATTICE; COINCIDENT AXIAL DIRECTION; ELECTRON BACKSCATTERED DIFFRACTION; TRIPLE JUNCTION;

GRAIN BOUNDARIES;

EID: 0031199346     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(97)00004-9     Document Type: Article

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