MEM'S: The word for optical beam manipulation - Building microelectromechanical-based optical systems on a silicon chip

IEEE Circuits and Devices Magazine

Volumn 13, Issue 4, 1997, Pages 11-17

  Lau, Kam Y ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FIBER LASERS; FIBER OPTICS; INTEGRATED CIRCUIT MANUFACTURE; INTEGRATED OPTOELECTRONICS; MIRRORS; OPTICAL SHUTTERS; OPTICAL SWITCHES; OPTICAL SYSTEMS; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; WSI CIRCUITS;

OPTICAL BEAM MANIPULATION; SILICON OPTICAL BENCH (SOB) TECHNOLOGY;

MICROELECTROMECHANICAL DEVICES;

EID: 0031193097     PISSN: 87553996     EISSN: None     Source Type: Journal    
DOI: 10.1109/101.600704     Document Type: Article

References (3)

1. M.S. Cohen, M.F. Cina, E. Bassous, M.M. Opyrsko, J.L. Speidell, et al., "Packaging of High-Density Fiber/Laser Modules Using Passive Alignment Techniques," IEEE Trans. on Components, Hybrids, and Manuf. Tech., vol. 15, (6), pp. 944-954, December 1992.
2. M.J. Wale and C. Edge, "Self-aligned flip-chip assembly of photonic devices with electrical and optical connections," IEEE Trans. on Components, Hybrids, and Manuf. Tech., vol 13, (4), pp. 780-786, December 1990.
3. O. Solgaard, M. Daneman, N. Tien, A. Friedberger, R.S. Muller, and K.Y. Lau, "Optoelectronic packaging using silicon surface-micromachined