Liquid-exchange processing and properties of SiC-Al composites

Journal of Materials Research

Volumn 12, Issue 7, 1997, Pages 1785-1789

  Hozer, Leszek ^a   Chiang, Yet Ming ^a   Ivanova, Svetlana ^b   Bar On, Isa ^b  

^a Massachusetts Institute of Technology   (United States)

^b WORCESTER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM ALLOYS; ELECTRONICS PACKAGING; FRACTURE TOUGHNESS; SILICON CARBIDE; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL EXPANSION;

LIQUID EXCHANGE PROCESS; REACTION BONDED SILICONIZED SILICON CARBIDE (RBSC);

METALLIC MATRIX COMPOSITES;

EID: 0031192060     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.1997.0246     Document Type: Article

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