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Volumn 37, Issue 7 SPEC. ISS., 1997, Pages 1039-1043

Thin oxide MOS damage generated after treatment in a merie reactor

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ELECTRIC CURRENT MEASUREMENT; GATES (TRANSISTOR); INTERFACES (MATERIALS); MAGNETRONS; PLASMAS; REACTIVE ION ETCHING; VOLTAGE MEASUREMENT;

EID: 0031191637     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0026-2714(96)00266-1     Document Type: Article
Times cited : (1)

References (10)
  • 1
    • 0001587890 scopus 로고
    • Gate oxide damage from polysilicon etching
    • Gabriel, C. T., Gate oxide damage from polysilicon etching. J. Vac. Technol., 1991, B9, 370-373.
    • (1991) J. Vac. Technol. , vol.B9 , pp. 370-373
    • Gabriel, C.T.1
  • 2
    • 0002070177 scopus 로고
    • How plasma etching damages thin gate oxides
    • Gabriel, C. T. and McVittie, J. P., How plasma etching damages thin gate oxides. Solid St. Techn., 1992, 35, 81-87.
    • (1992) Solid St. Techn. , vol.35 , pp. 81-87
    • Gabriel, C.T.1    McVittie, J.P.2
  • 3
    • 0026882443 scopus 로고
    • A model and experiments for thin oxide damage form wafer charging in magnetron plasmas
    • Fang, S. and McVittie, J., A model and experiments for thin oxide damage form wafer charging in magnetron plasmas. IEEE Electr. Dev. Lett., 1992, 1, 347-349.
    • (1992) IEEE Electr. Dev. Lett. , vol.1 , pp. 347-349
    • Fang, S.1    McVittie, J.2
  • 5
    • 0027693956 scopus 로고
    • Modeling oxide thickness dependence of charging damage by plasma processing
    • Shin, S., Noguchi, K. and Hu, C., Modeling oxide thickness dependence of charging damage by plasma processing. IEEE Electr. Dev. Lett., 1993, 14, 509-511.
    • (1993) IEEE Electr. Dev. Lett. , vol.14 , pp. 509-511
    • Shin, S.1    Noguchi, K.2    Hu, C.3
  • 6
    • 0026259524 scopus 로고
    • Dependence of gate oxide breakdown frequency on ion current density distributions during electron cyclotron resonance etching
    • Samukawa, S., Dependence of gate oxide breakdown frequency on ion current density distributions during electron cyclotron resonance etching. Jap. J. Appl. Phys., 1991, 30, L1902-L1904.
    • (1991) Jap. J. Appl. Phys. , vol.30
    • Samukawa, S.1
  • 7
    • 0042316266 scopus 로고
    • A magnetic multipole reactor for high-flux reactive-ion etching
    • Kuypers, A. D., Granneman, E. H. A. and Hopman, H. J., A magnetic multipole reactor for high-flux reactive-ion etching. J. Appl. Phys., 1988, 63, 1899-1902.
    • (1988) J. Appl. Phys. , vol.63 , pp. 1899-1902
    • Kuypers, A.D.1    Granneman, E.H.A.2    Hopman, H.J.3
  • 9
    • 30844431996 scopus 로고
    • MOS interface states: Overview and physicochemical perspective
    • Poindexter, E. H., MOS interface states: overview and physicochemical perspective. Semicond. Sci. Technol., 1989, 4, 961-969.
    • (1989) Semicond. Sci. Technol. , vol.4 , pp. 961-969
    • Poindexter, E.H.1
  • 10
    • 36449008064 scopus 로고
    • Plasma-charging damage: A physical model
    • Cheung, K. P. and Chang, C. P., Plasma-charging damage: a physical model. J. Appl. Phys., 1994, 75, 4415-4426.
    • (1994) J. Appl. Phys. , vol.75 , pp. 4415-4426
    • Cheung, K.P.1    Chang, C.P.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.