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Volumn 37, Issue 7, 1997, Pages 935-946

Fixed-abrasive grinding of brittle hard-disk substrates

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; COST EFFECTIVENESS; DISKS (MACHINE COMPONENTS); FABRICATION; GLASS; GRINDING MACHINES; SUBSTRATES;

EID: 0031191340     PISSN: 08906955     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0890-6955(96)00089-2     Document Type: Article
Times cited : (21)

References (19)
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  • 4
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    • Brittle to shear grinding mode transition for loose abrasive grinding
    • Proc. Workshop on Optical Fabrication and Testing. Optical Society of America
    • N. Brown and B. A. Fuchs, Brittle to shear grinding mode transition for loose abrasive grinding. Proc. Workshop on Optical Fabrication and Testing. OSA Technical Digest Series, Vol. 13, Optical Society of America, p. 23 (1988).
    • (1988) OSA Technical Digest Series , vol.13 , pp. 23
    • Brown, N.1    Fuchs, B.A.2
  • 5
    • 0026154663 scopus 로고
    • Ductile regime grinding: A new technology for machining brittle materials
    • T. G. Bifano, T. A. Dow and R. O. Scattergood, Ductile regime grinding: a new technology for machining brittle materials, Trans. ASME J. Engng Ind. 113, 184 (1991).
    • (1991) Trans. ASME J. Engng Ind. , vol.113 , pp. 184
    • Bifano, T.G.1    Dow, T.A.2    Scattergood, R.O.3
  • 7
    • 0028017240 scopus 로고
    • Material removal mechanisms in grinding of ceramics
    • B. Zhang and T. D. Howes, Material removal mechanisms in grinding of ceramics, Ann. CIRP 43(1), 305 (1994).
    • (1994) Ann. CIRP , vol.43 , Issue.1 , pp. 305
    • Zhang, B.1    Howes, T.D.2
  • 8
    • 0027642567 scopus 로고
    • Precision grinding of ultra-thin quartz wafers
    • T. G. Bifano and I. Hosler, Precision grinding of ultra-thin quartz wafers, ASME J. Engng Ind. 115(3), 258 (1993).
    • (1993) ASME J. Engng Ind. , vol.115 , Issue.3 , pp. 258
    • Bifano, T.G.1    Hosler, I.2
  • 9
    • 0042857324 scopus 로고
    • Ultraprecision grinding technology for brittle materials: Application to surface and centerless grinding processes
    • Milton C. Shaw Grinding Symp., edited by R. Komanduri and D. Maas, ASME, New York
    • J. Yoshioka, K. Koizumi, M. Shimizu, H. Yoshikawa, M. Miyashita and A. Kanai. Ultraprecision grinding technology for brittle materials: application to surface and centerless grinding processes. Milton C. Shaw Grinding Symp., edited by R. Komanduri and D. Maas, ASME PED Vol. 16, p. 209. ASME, New York (1985).
    • (1985) ASME PED , vol.16 , pp. 209
    • Yoshioka, J.1    Koizumi, K.2    Shimizu, M.3    Yoshikawa, H.4    Miyashita, M.5    Kanai, A.6
  • 10
    • 0006620587 scopus 로고
    • Fixed-abrasive grinding CVD silicon carbide mirrors
    • T. G. Bifano, W. K. Kahl and Y. Yi, Fixed-abrasive grinding CVD silicon carbide mirrors, J. Precision Engng 16(2), 109 (1994).
    • (1994) J. Precision Engng , vol.16 , Issue.2 , pp. 109
    • Bifano, T.G.1    Kahl, W.K.2    Yi, Y.3
  • 13
    • 0028099127 scopus 로고
    • Acoustic emission for process control and monitoring of surface integrity during grinding
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    • Webster, J.A.1    Marinescu, I.D.2    Bennett, R.3    Lindsay, R.4
  • 14
    • 0001081113 scopus 로고
    • Acoustic emission as an indicator of material-removal regime in glass microgrinding
    • T. G. Bifano and Y. Yi, Acoustic emission as an indicator of material-removal regime in glass microgrinding, J. Precision Engng 14(4), 219 (1992).
    • (1992) J. Precision Engng , vol.14 , Issue.4 , pp. 219
    • Bifano, T.G.1    Yi, Y.2
  • 15
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  • 19
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    • Design strategies of an ultraprecision surface grinding machine for ductile mode surface finishing of brittle materials
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.