Surface electromigration of Au-Ag binary film on SiO2

Journal of Materials Science Letters

Volumn 16, Issue 13, 1997, Pages 1205-1207

  Shi, F X ^a   Yao, W Q ^a   Cao, L L ^a   Dong, Y H ^b  

^a TSINGHUA UNIVERSITY   (China)

^b INSTITUTE OF GEOLOGY AND GEOPHYSICS   (China)

Author keywords

[No Author keywords available]

Indexed keywords

AUGER ELECTRON SPECTROSCOPY; BINARY ALLOYS; DIFFUSION IN SOLIDS; ELECTRIC CURRENTS; ELECTROMIGRATION; GOLD ALLOYS; INTERFACIAL ENERGY; MORPHOLOGY; SILICA; SURFACE ROUGHNESS; THERMAL EXPANSION; ULTRATHIN FILMS;

COMPRESSIVE STRESSES;

METALLIC FILMS;

EID: 0031190659     PISSN: 02618028     EISSN: None     Source Type: Journal    
DOI: 10.1007/bf02765411     Document Type: Article

References (5)

1. F. M. D'HEURLE and P. S. HO, in "Thin Films - Interdiffusion and Reactions", edited by J. M. Poate, K. N. Tu and J. W. Mayer (Wiley, New York, 1978) Ch. 8.
2. M. PANICCIA, P. FLINN and R. REIFENBERGER, J. Appl. Phys. 73 (1993) 8189.
3. F. X. SHI and L. L. CAO, Vac. Sci. Technol. (China), 17(4), (1997) 197.
4. H. YASUNAGA and A. NATORI, Surf. Sci. Rep. 15 (1992) 209.
5. L. E. LEVINE, G. REISS and D. A. SMITH, Phys. Rev. B 48 (1993) 858.