New high thermal conductivity thermoplastics for power applications

Soldering and Surface Mount Technology

Volumn 9, Issue 2, 1997, Pages 55-57

  Dietz, R L ^b   Peck, D ^b   Robinson, P J ^b   Firmstone, M G ^a   Bartholomew, P M ^a   Paterson, G ^a  

^a Multicore Solders Ltd   (United Kingdom)

^b Diemat Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMISTRY; ELECTRONICS PACKAGING; FILLERS; HEAT SINKS; HEAT TRANSFER; PERFORMANCE; RELIABILITY; THERMAL CONDUCTIVITY; THERMODYNAMIC PROPERTIES; THERMOPLASTICS; VOLUME FRACTION;

DIE BOND LINE; THERMOPLASTIC ADHESIVE PASTE;

ADHESIVES;

EID: 0031190114     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540919710195172     Document Type: Article

References (5)

1. Hudson, T., 'Meeting MCM Performance Demands with Ceramics'. Electronic Packaging & Production, June (1994).
2. QM13555 Low Temperature Ag/glass Die Attach. Product Literature.
3. Jordan, M. and Shapire, H., 'Fundamentals of Engineering Thermodynamics'. John Wiley & Sons. Inc. (1988).
4. Dietz, R. L. and D., 'Enhancing Thermal Conductivity in Organic Adhesives'. Proceedings Conference on Adhesives in Electronics, Stockholm, June (1996).
5. Unisys Corporation, San Diego, CA. private communications.