Application of electron beam lithography to study microcreep deformation and grain boundary sliding

Journal of Materials Science

Volumn 32, Issue 13, 1997, Pages 3411-3417

  Kishimoto, S ^a   Shinya, N ^a   Mathew, M D ^b  

^a NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

^b INDIRA GANDHI CENTRE FOR ATOMIC RESEARCH   (India)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP TESTING; ELECTRON BEAM LITHOGRAPHY; GRAIN BOUNDARIES; PALLADIUM ALLOYS; SCANNING ELECTRON MICROSCOPY; STRAIN; STRESSES;

FINE ELECTRON SENSITIVE MICROGRIDS; GRAIN BOUNDARY SLIDING; MICROCREEP DEFORMATION;

COPPER;

EID: 0031190024     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1018668616331     Document Type: Article

References (11)

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