Selection of critical thermal/structural design parameters for a metal/composite joint in a composite electronics enclosure

Journal of Thermoplastic Composite Materials

Volumn 10, Issue 4, 1997, Pages 362-380

  Bailey, L E ^a,b   Roberts, J C ^a,c   Jones, D L ^b  

^a JOHNS HOPKINS UNIVERSITY   (United States)

^b GEORGE WASHINGTON UNIVERSITY   (United States)

^c Johns Hopkins University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FIBER REINFORCED METALS; INTERFACES (MATERIALS); RESISTORS; STRAIN; TENSILE TESTING; THERMOCOUPLES;

BONDED SINGLE LAP JOINT; SURFACE MOUNTED CHIP RESISTOR;

ELECTRONICS PACKAGING;

EID: 0031188195     PISSN: 08927057     EISSN: None     Source Type: Journal    
DOI: 10.1177/089270579701000405     Document Type: Article

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