Stress relaxation and creep in an impression test

Journal of Electronic Materials

Volumn 26, Issue 7, 1997, Pages 827-832

  Li, James C M ^a  

^a University of Rochester   (United States)

Author keywords

Creep; Dislocation dynamics; Impression test; Interfacial sliding; LiF; Sn Pb alloy; Solder; Stress relaxation; Superplasticity

Indexed keywords

CREEP TESTING; DATA ACQUISITION; DEFORMATION; DISLOCATIONS (CRYSTALS); INTERFACES (MATERIALS); SOLDERING ALLOYS; STRESS RELAXATION; SUPERPLASTICITY; TIN ALLOYS;

DISLOCATION DYNAMICS; IMPRESSION TESTS; INTERFACIAL SLIDING;

MATERIALS TESTING;

EID: 0031187061     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-997-0258-6     Document Type: Article

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