IC failure analysis: The importance of test and diagnostics

IEEE Design and Test of Computers

Volumn 14, Issue 3, 1997, Pages 76-82

  Vallett, David P ^a,b,c,d,e  

^a IBM MICROELECTRONICS   (United States)

^b Sematech Product Analysis Forum ^*  (United States)

^c UNIVERSITY AT BUFFALO   (United States)

^d IEEE   (United States)

^e National Engineering Honor Society   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER HARDWARE; COMPUTER SIMULATION; COMPUTER SOFTWARE; COST EFFECTIVENESS; FAILURE ANALYSIS; INSPECTION; INTEGRATED CIRCUIT LAYOUT; SCANNING ELECTRON MICROSCOPY; VALUE ENGINEERING;

DIRECT CHIP ATTACH (DCA) PACKAGING;

INTEGRATED CIRCUIT TESTING;

EID: 0031186690     PISSN: 07407475     EISSN: None     Source Type: Journal    
DOI: 10.1109/54.606001     Document Type: Article

References (9)

1. S.M. Kudva et al., "The Sematech Failure Analysis Roadmap," Proc. 21st Int'l Symp. Testing and Failure Analysis, ASM Int'l, Materials Park, Oh., 1995, pp. 1-5.
2. The National Technology Roadmap for Semiconductors, Semiconductor Industry Association, San Jose, Calif., 1994.
3. R.E. Anderson et al., "Future Technology Challenges for Failure Analysis," Proc. 21st Int'l Symp. Testing and Failure Analysis, 1995, pp. 27-32.
4. T.S. Taylor et al., "Leakage Detection Techniques: A Comparative Study," Proc. 15th Int'l Symp. Testing and Failure Analysis, 1989, pp. 5-13.
5. B. Bossman et al., "Failure Analysis Techniques with the Confocal Laser Scanning Microscope," Proc. 18th Int'l Symp. Testing and Failure Analysis, 1992, pp. 351-361.
6. H.Y. Chang et al., Fault Diagnosis of Digital Systems, Wiley Interscience, New York, 1970, pp. 126-140.
7. R.C. Aitken, "Finding Defects with Fault Models," Proc. Int'l Test Conf., IEEE Computer Society Press, Los Alamitos, Calif., 1995, pp. 498-505.
8. E.B. Eichelberger et al., Structured Logic Testing, Prentice-Hall, Inc., Englewood Cliffs, N.J., 1991, pp. 112, 167.
9. R.C. Aitken, "Fault Location with Current Monitoring," Proc. Int'l Test Conf., IEEE CS Press, 1991, pp. 623-632.