Thermal, solvent, and vacuum debinding mechanisms of PIM compacts

Materials and Manufacturing Processes

Volumn 12, Issue 4, 1997, Pages 593-608

  Hwang, K S ^a   Lin, H K ^a   Lee, S C ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BINDERS; CRACK INITIATION; DECOMPOSITION; EXTRACTION; MICROSTRUCTURE; PARAFFIN WAXES; POROSIMETERS; POROSITY; SCANNING ELECTRON MICROSCOPY; SOLVENTS; THERMAL EFFECTS; VACUUM APPLICATIONS;

MERCURY INTRUSION POROSIMETRY; POWDER INJECTION MOLDING (PIM); VACUUM DEBINDING;

INJECTION MOLDING;

EID: 0031186637     PISSN: 10426914     EISSN: None     Source Type: Journal    
DOI: 10.1080/10426919708935169     Document Type: Article

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