Effect of copper lamination on the rheological and copper adhesion properties of a thermotropic liquid crystalline polymer used in PCB applications

IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing

Volumn 20, Issue 3, 1997, Pages 219-226

  Khoo, Cynthia G L ^a   Brox, Bill ^a   Norrhede, Rikard ^a   Maurer, Frans H J ^a  

^a Engineering Research   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COPPER; CRYSTALLIZATION; LAMINATING; LIQUID CRYSTAL POLYMERS; METAL FOIL; RHEOLOGY; SUBSTRATES; THERMOTROPIC LIQUID CRYSTALS;

COPPER LAMINATION; THERMOTROPIC LIQUID CRYSTALLINE POLYMERS;

PRINTED CIRCUIT MANUFACTURE;

EID: 0031177091     PISSN: 10834400     EISSN: None     Source Type: Journal    
DOI: 10.1109/3476.649445     Document Type: Article

References (16)

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