Effects of small silver addition to AuCu on the AuCu I ordering process and age-hardening behaviours

Journal of Alloys and Compounds

Volumn 257, Issue 1-2, 1997, Pages 306-312

  Shiraishi, T ^a   Ohta, M ^a   Nakagawa, M ^a   Ouchida, R ^a  

^a KYUSHU UNIVERSITY   (Japan)

Author keywords

Age hardening; Antiphase boundary; Gold copper silver alloy; Ordering; Twin

Indexed keywords

AGE HARDENING; ALLOYING ELEMENTS; COMPOSITION EFFECTS; DENSITY (SPECIFIC GRAVITY); HARDNESS TESTING; OPTICAL MICROSCOPY; SILVER; TRANSMISSION ELECTRON MICROSCOPY; TWINNING; X RAY POWDER DIFFRACTION;

ANTIPHASE BOUNDARY; SOFTENING RATE;

GOLD ALLOYS;

EID: 0031176416     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0925-8388(97)00006-6     Document Type: Article

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