Low power GaAs current-mode 1.2 Gb/s interchip interconnections

IEEE Journal of Solid-State Circuits

Volumn 32, Issue 6, 1997, Pages 890-897

  Long, Stephen I ^a,b,d,e,f,g   Zhang, Johnny Qi ^c,h,i,j,k,l  

^a IEEE   (United States)

^b University of California   (United States)

^c HEWLETT PACKARD COMPANY   (United States)

^d UNIVERSITY OF CALIFORNIA   (United States)

^e Cornell University ^*  (United States)

^f VARIAN MEDICAL SYSTEMS   (United States)

^g ROCKWELL SCIENCE CENTER   (United States)

^h PEKING UNIVERSITY   (China)

ⁱ BEIJING INSTITUTE OF TECHNOLOGY   (China)

^j ARIZONA STATE UNIVERSITY   (United States)

^k UNIVERSITY OF CALIFORNIA   (United States)

^l LUCENT TECHNOLOGIES   (United States)

more..

Author keywords

Current mode interconnections; Feedback circuits; Integrated circuit desing; Integrated circuit interconnections; Logic design; Multichip modules; Very high speed integrated circuits

Indexed keywords

AMPLIFIERS (ELECTRONIC); ELECTRIC POWER SUPPLIES TO APPARATUS; ELECTRIC WIRING; ENERGY DISSIPATION; INTEGRATED CIRCUIT LAYOUT; LOGIC DESIGN; MULTICHIP MODULES; SEMICONDUCTING GALLIUM ARSENIDE;

CURRENT MODE INTERCONNECTIONS; FEEDBACK CIRCUITS; INTEGRATED CIRCUIT INTERCONNECTIONS; TRANSIMPEDANCE AMPLIFIER; VERY HIGH SPEED INTEGRATED CIRCUITS;

LOGIC CIRCUITS;

EID: 0031168459     PISSN: 00189200     EISSN: None     Source Type: Journal    
DOI: 10.1109/4.585291     Document Type: Article

References (9)

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