Nb3Sn artificial pinning microstructures

IEEE Transactions on Applied Superconductivity

Volumn 7, Issue 2 PART 2, 1997, Pages 1201-1204

  Dietderich, Daniel R ^a   Scanlan, Ronald M ^a  

^a LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CRITICAL CURRENT DENSITY (SUPERCONDUCTIVITY); CRYSTAL MICROSTRUCTURE; DEPOSITION; DOPING (ADDITIVES); GRAIN SIZE AND SHAPE; INTERMETALLICS; NIOBIUM COMPOUNDS; SOLUBILITY; TIN; TITANIUM; YTTRIUM;

ARTIFICIAL PINNING CENTER (APC);

SUPERCONDUCTING FILMS;

EID: 0031166082     PISSN: 10518223     EISSN: None     Source Type: Journal    
DOI: 10.1109/77.620719     Document Type: Article

References (6)

1. D.R. Dietderich and R.M. Scanlan, "Characterization of Superconductors with Artificial Pinning Microstructures", IEEE Trans. on App. Super., Vol. 5, 1995.
2. 3Sn", GE Research & Development Center, Materials Characterization Laboratory, Report Number 90CRD265, December 1990.
3. 3Sn Grains", Met. Trans. vol. 25A, pp 213-219, January 1994.
4. 3Sn Wires: Preparation and Characterization", IEEE Trans. on Mag., Vol 25, No. 2. pp 2196-2199, March 1989.
5. K. De Moranville, D. Yu, J. Wong, " Development of a Niobium-Tin Multifilamentary Wire with Artificial Tantalum Inclusions", IEEE Trans. on App. Super., Vol. 3, No.1 pp 982-985, March 1993.
6. L.R. Motowidlo, Intermagnetics General Corporation, private communication.