Photoresist damage in reactive ion etching processes

Journal of the Electrochemical Society

Volumn 144, Issue 6, 1997, Pages 2150-2154

  Walter, Lee ^a  

^a EASTMAN KODAK COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; DEGRADATION; GLASS TRANSITION; PHOTORESISTS; PLASMA ETCHING; REACTIVE ION ETCHING; SILICA; THERMAL EFFECTS;

RADIO FREQUENCY POWER DENSITY;

THIN FILMS;

EID: 0031165535     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1837755     Document Type: Article

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