Electrodeposition of copper and nickel on InBi alloy electrodes

Journal of Applied Electrochemistry

Volumn 27, Issue 6, 1997, Pages 699-705

  Azzag, M ^a   Chatelut, M ^a   Vittori, O ^a  

^a UNIVERSITÉ LYON 1   (France)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CURRENT DENSITY; ELECTRODEPOSITION; INDIUM ALLOYS; MELTING; NICKEL;

SOFT ALLOYS;

ELECTROCHEMICAL ELECTRODES;

EID: 0031164173     PISSN: 0021891X     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1018491905483     Document Type: Article

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