Ion energy distributions in reactive arc evaporation discharges used for deposition of TiN films

Surface and Coatings Technology

Volumn 92, Issue 1-2, 1997, Pages 150-156

  Ivanov, I ^a   Ljungcrantz, H ^b   Hakansson G ^b   Petrov, I ^c   Sundgren, J E ^a  

^a LINKÖPING UNIVERSITY   (Sweden)

^b Tixon AB   (Sweden)

^c UNIVERSITY OF ILLINOIS AT SPRINGFIELD   (United States)

Author keywords

Deposition; Ion energy distribution; Reactive arc evaporation; Tin films

Indexed keywords

CATHODES; CURRENT DENSITY; ELECTRON ENERGY LEVELS; ELECTROSTATICS; EVAPORATION; NITROGEN;

ELECTROSTATIC RETARDING FIELD ANALYZER (RFA); ION ENERGY DISTRIBUTION FUNCTION (IEDF);

TITANIUM NITRIDE;

EID: 0031163625     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(96)03152-0     Document Type: Article

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