Increased PCB throughput via reflow oven design

SMT Surface Mount Technology Magazine

Volumn 11, Issue 6, 1997, Pages 52-54

  Feely, Rich ^a   Menard, Jean Pierre ^a  

^a Research International   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INDUSTRIAL OVENS; MAINTENANCE; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; PRODUCTION ENGINEERING;

FLUX CLEANING MAINTENANCE DOWNTIME; REFLOW OVENS;

SURFACE MOUNT TECHNOLOGY;

EID: 0031153005     PISSN: 15298930     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (7)

1. Raman, "Optimizing Cycle Time in High Speed SMT Lines," Proceedings, Surface Mount International 1996, p. 567.
2. Bailey and Davis, "Reflow Cooling Technique: Impact on Maintenance and Process," Proceedings, NEPCON West 1997, p. 834.
3. Menard, "Minimizing Nitrogen Consumption in a Convection Reflow Oven," Proceedings, NEPCON East 1995.
4. Customer proprietary discussion with authors.
5. Customer proprietary discussion with authors.
6. Goldratt, "The Goal," p. 157.
7. Lasky and Baldwin, "Throughput: The Critical Cost Variable in DCA Assembly," SMTA National Symposium, November 1996.