Size effect on thermal conduction in silicon-on-insulator devices under electrostatic discharge (ESD) conditions

Japanese Journal of Applied Physics, Part 2: Letters

Volumn 36, Issue 6, 1997, Pages

  Ju, Yongho Sungtaek ^a   Goodson, Kenneth Eugene ^a  

^a STANFORD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC DISCHARGES; ELECTROSTATICS; PHONONS; THERMAL CONDUCTIVITY OF SOLIDS; THIN FILM DEVICES;

ELECTROSTATIC DISCHARGE (ESD);

SILICON ON INSULATOR TECHNOLOGY;

EID: 0031152390     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.36.l798     Document Type: Article

References (14)