Tear-off wear mechanism of sintered diamond tool in cutting SiC-particle-strengthened epoxy composites

Wear

Volumn 206, Issue 1-2, 1997, Pages 221-229

  Afaghani, J E D ^a,b   Yamaguchi, K ^a   Nakamoto, T ^a   Yoshino, K ^a  

^a NAGOYA UNIVERSITY   (Japan)

^b UNIVERSITY OF ALEPPO   (Syrian Arab Republic)

Author keywords

Cutting; Dispersion strengthened composite; Plastic composite; Silicon carbide particle; Sintered diamond tool; Tear off mechanism; Tool wear

Indexed keywords

COMPOSITION EFFECTS; CUTTING; EPOXY RESINS; GRAIN SIZE AND SHAPE; PARTICLES (PARTICULATE MATTER); REINFORCED PLASTICS; SILICON CARBIDE; SINTERING; WEAR OF MATERIALS; WEAR RESISTANCE;

SINTERED DIAMONDS; TEAR OFF WEAR;

DIAMOND CUTTING TOOLS;

COMPOSITES; CUTTING TOOLS; DIAMOND TOOLS; WEAR;

EID: 0031148083     PISSN: 00431648     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0043-1648(96)07458-3     Document Type: Article

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