Effect of grain boundary segregation on thermal conductivity of hot-pressed silicon carbide

Acta Materialia

Volumn 45, Issue 5, 1997, Pages 2001-2012

  Kinoshita, Toshiya ^a,b   Munekawa, Shigeru ^a  

^a JAPAN SCIENCE AND TECHNOLOGY AGENCY   (Japan)

^b NIPPON STEEL CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; ALUMINA; CRYSTAL LATTICES; GRAIN BOUNDARIES; HOT PRESSING; MATHEMATICAL MODELS; PHASE INTERFACES; PHONONS; POINT DEFECTS; SINTERING; THERMAL CONDUCTIVITY OF SOLIDS; TRANSMISSION ELECTRON MICROSCOPY;

DEBYE PHONON MODEL; GRAIN BOUNDARY SCATTERING;

SILICON CARBIDE;

EID: 0031146429     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(96)00298-4     Document Type: Article

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