Attempt to evaluate the bond quality of thin soldered laminate using the laser Lamb wave

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 36, Issue 5 SUPPL. B, 1997, Pages 3270-3275

  Futatugi, Takashi ^a   Takemoto, Mikio ^a  

^a AOYAMA GAKUIN UNIVERSITY   (Japan)

Author keywords

Bond quality; Laser lamb wave; Multilayered laminate; Velocity dispersion

Indexed keywords

BOND QUALITY; LASER LAMB WAVE; THIN SOLDERED LAMINATE;

ALGORITHMS; COMPUTATIONAL METHODS; COPPER; ELECTROMAGNETIC DISPERSION; ESTIMATION; LAMINATES; MATHEMATICAL MODELS; METAL FOIL; Q SWITCHED LASERS; WAVELET TRANSFORMS;

SOLDERING;

EID: 0031146328     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.36.3270     Document Type: Review

References (6)

1. D. Lian, Y. Suga, G. Shou and S. Kurihara: J. Thermal Splay Tech. 5 (1996) 128.
2. H. Cho, S. Ogawa and M. Takemoto: Proc. 8th Asia-Pacific Conf. Nondestructive Testing, Taipe, Taiwan (1995) p. 17.
3. P. Lloyd and M. Redwood: Austica 16 (1965/66) 224.
4. R. Jones and E. N. Thrower: J. Sound Vib. 2 (1965) 167.
5. Y. Hayashi, S. Ogawa, H. Cho and M. Takemoto: J. Jpn.Soc. Non- Destruct. Inspect. 46 (1997) 58.
6. R. Sato and T. Takemoto: Highly Reliable Micro Soldering Technology (Kogyo Chosakai, 1990) [in Japanese].