Secondary ion mass spectrometry of a copper polyimide thin film packaging technology

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 15, Issue 3, 1997, Pages 1328-1333

  Parks, Christopher C ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AMINOSILANES; BURIED DEFECT; COPPER THIN FILM; ELEMENTAL PROFILE; ION IMPLANT; ION YIELDS; POLYIMIDE THIN FILMS; PRIMARY BEAMS;

CESIUM; CHLORINE; CHROMIUM; DEFECTS; IONS; MONOLAYERS; SECONDARY EMISSION; SECONDARY ION MASS SPECTROMETRY; SPECTROMETRY; THIN FILMS; COPPER; CRYSTAL DEFECTS; CRYSTAL IMPURITIES; INTERFACES (MATERIALS); ION IMPLANTATION; POLYIMIDES;

POLYIMIDES; ELECTRONICS PACKAGING;

AMINOSILANE ADHESION PROMOTOR; BURIED DEFECTS;

EID: 0031146239     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.580584     Document Type: Article

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